Flexible electronics on polymer substrates that perform normally in use but dissolve on demand — unlocking end-of-life recovery of the chips, metals, and materials now buried in e-waste.

EnduraCure

venture active confidence: Medium status: Draft updated 2026-07-14

Type
venture
Status
Draft
Confidence
Medium
Tier
C
Builder-tier
B
Activity-signal
2025-10-01 · https://nsf.elsevierpure.com/en/organisations/enduracure-llc/
Activity-checked
2026-08-14
Focus
degradable polymers, flexible electronics, e-waste, materials science, recyclable substrates
Roles
physical-sciences, manufacturing-operations, sales-business-development
Stage
Early-stage spinout; NSF STTR Phase I funded
Primary Location
Salt Lake City, UT
Utah Location
Salt Lake City, UT
Region
Salt Lake City
Website
https://enduracure.com
Updated
2026-07-14
Needs-reviewed
2026-07-14
Relates
cites Official Website: EnduraCure · https://enduracure.com

Summary

EnduraCure is a Salt Lake City startup spun out of Doctor Chen Wang's lab in the Department of Materials Science and Engineering at the University of Utah, founded around 2024. EnduraCure provides a bounded benefit: Global e-waste is growing faster than the overall economy.

Impact

Global e-waste is growing faster than the overall economy. Recycling rates are below 20%, and the valuable materials in electronics — rare earths, gold, cobalt, semiconductor-grade silicon — are effectively being landfilled because circuit boards bond electronics to substrates that cannot be cleanly separated without destroying the components. EnduraCure's approach attacks that bonding problem at the substrate level.

If the chemistry works at commercial scale, the first market is medical sensors and wearables — high-value-per-unit electronics with relatively small form factors where recyclability commands premium pricing and regulatory interest. The second-order impact is pressure on the broader consumer electronics industry toward designed-for-recycling substrates, particularly if medical device regulations or EU electronics directives move in that direction.

What They Are Building

EnduraCure is developing photocured polymer substrates that provide the dimensional stability, thermal and humidity resistance, and fabrication compatibility of conventional flexible electronics substrates, while incorporating a triggered dissolution mechanism. The polymer dissolves cleanly in a mild solvent bath that is not triggered by normal use conditions — sweat, rain, or cleaning. The recovery yield of electronic components from the dissolved substrate needs to be high enough for recycling economics to work at industrial scale.

The Chen Wang lab at the University of Utah is the research base; EnduraCure is the vehicle to bridge from lab chemistry to manufacturable substrate product.

What They Need Now

Polymer chemists, materials scientists, electronics manufacturing engineers, and business development people who understand the flexible-electronics supply chain. This is an early-stage academic spinout — the team is small, roles are broad, and individual leverage is very high. The right environment for someone who wants to build a new materials company from the ground up rather than join an established manufacturer.

Who Could Help

University of Utah Technology Licensing Office connections to manage IP licensing; medical device OEM partnerships for first commercial deployments; NSF program officers familiar with Phase II paths for STTR materials bets; and investors experienced with deep materials science companies where the development timelines are long.

Utah Context

EnduraCure is a direct product of the University of Utah's materials science research enterprise. The U of U has a strong history of spinning out companies from its research labs — particularly in biomedical and materials domains. The Nucleus Institute and related Utah innovation infrastructure provide early-stage support for exactly this kind of university spinout.

Evidence

See Also

  • Ionic MT — another Utah advanced materials company building on novel chemistry with domestic supply chain implications.

Open Questions

  • No agent-readable careers/jobs page found (enduracure.com has no careers/jobs path or ATS board).
  • What is the current state of the dissolution chemistry — lab-scale demonstration only, or early prototype substrate samples?
  • Has EnduraCure filed any patents on the photocured substrate formulation, and what is the IP position relative to the U of U TLO?
  • Which specific flexible electronics applications (medical sensors, smart packaging, wearables) are targeted for first commercial pilot?
  • Is Dennis Pruzan still CEO and is the team still Utah-based?